An FPGA SoC on a 22 × 80 mm M.2 card.
Compact M.2 2280 module built around an AMD Zynq UltraScale+ MPSoC with LPDDR4 memory, eMMC storage, Gigabit Ethernet and CAN. The SoC, memory and interface devices sit on one side of the card, with power conversion and support circuitry on the other. Designed in Altium on a 10-layer stack-up.

The board
The module is a 10-layer board with 850 components, designed in Altium. It follows the standard M.2 2280 outline (22 × 80 mm) with a B+M-key edge connector, plus castellated pads along the far edge. It places an AMD Zynq UltraScale+ MPSoC next to Micron LPDDR4 memory and 8 GB of Micron eMMC, with a Microchip LAN7431 Gigabit Ethernet controller, an NXP TJA1057 CAN transceiver and on-board power conversion around a Renesas ISL91301 PMIC.
All layers combined: dense BGA fan-out under the Zynq SoC, length-matched LPDDR4 routing to the memory beside it, and solid ground areas under the power stages, all within the 22 mm width of the card.



Design highlights
AMD Zynq UltraScale+ MPSoC, combining Arm processors and FPGA fabric, on a standard M.2 2280 card.
Micron LPDDR4 memory placed directly beside the SoC for a short, matched memory interface.
8 GB Micron eMMC for boot and storage, with a Microchip LAN7431 Gigabit Ethernet controller.
NXP TJA1057 CAN transceiver and DIP switches for field configuration.
Renesas ISL91301 PMIC and on-board regulators generate the SoC and memory rails from the M.2 supply.
B+M-key edge connector plus castellated pads, so the module can plug in or be soldered down.
Building something similar?
Multi-camera, edge AI or high-speed boards. Talk to the team that designed this one.